Supermicro and NVIDIA have joined forces to introduce cutting-edge AI solutions at the GTC 2025 Conference. The collaboration showcases the NVIDIA Blackwell Ultra platform, featuring the NVIDIA HGX B300 NVL16 and NVIDIA GB300 NVL72 platforms. These new systems and rack solutions are designed to enhance AI performance, offering up to 800 Gb/s direct-to-GPU networking performance.
Supermicro’s President and CEO, Charles Liang, expressed his enthusiasm for the partnership with NVIDIA. He highlighted Supermicro’s Data Center Building Block Solutions approach, which has paved the way for the development of air- and liquid-cooled systems optimized for the NVIDIA HGX B300 NVL16 and GB300 NVL72. The advanced liquid-cooling solution boasts exceptional thermal efficiency, operating with 40℃ warm water in an 8-node rack configuration or 35℃ warm water in a double-density 16-node rack configuration. This innovative solution not only reduces power consumption by up to 40% but also conserves water resources, offering environmental and operational cost benefits for enterprise data centers.
NVIDIA’s Blackwell Ultra platform is specifically engineered to tackle the most demanding cluster-scale AI applications by addressing performance bottlenecks related to GPU memory capacity and network bandwidth limitations. The platform delivers an impressive 288GB HBM3e of memory per GPU, significantly enhancing AI FLOPS for AI training and inference tasks. The integration of NVIDIA Quantum-X800 InfiniBand and Spectrum-X™ Ethernet networking platforms doubles the compute fabric bandwidth, reaching speeds of up to 800 Gb/s.
Supermicro has seamlessly integrated NVIDIA Blackwell Ultra into two distinct solutions: the Supermicro NVIDIA HGX B300 NVL16 systems, ideal for all data centers, and the NVIDIA GB300 NVL72, equipped with NVIDIA’s next-generation Grace Blackwell architecture.
The Supermicro NVIDIA HGX B300 NVL16 system is designed as the industry-standard building block for AI training clusters, featuring an 8-GPU NVIDIA NVLink™ domain and a high-performance 1:1 GPU-to-NIC ratio. The B300 NVL16 system enhances this architecture with thermal design advancements in both liquid-cooled and air-cooled versions. With a brand new 8U platform, the B300 NVL16 maximizes the output of the NVIDIA HGX B300 NVL16 board, offering a massive 2.3TB of HBM3e per system.
On the other hand, the NVIDIA GB300 NVL72 integrates 72 NVIDIA Blackwell Ultra GPUs and 36 NVIDIA Grace™ CPUs in a single rack, providing exascale computing capacity. With over 20TB of HBM3e memory capacity interconnected in a 1.8TB/s 72-GPU NVLink domain, the GB300 NVL72 significantly boosts cluster-level performance of the AI compute fabric.
Supermicro’s expertise in liquid cooling, data center deployment, and the building block approach enables the seamless deployment of NVIDIA Blackwell Ultra with industry-leading time-to-deployment. The company offers a comprehensive liquid cooling portfolio, including direct-to-chip cold plates, a 250kW in-rack CDU, and cooling tower solutions.
To learn more about Supermicro’s AI solutions powered by NVIDIA Blackwell Ultra, visit their official website. Visit Supermicro at the GTC 2025 Conference in San Jose, CA from March 17-21, 2025, and explore the X14/H14 B200, B300, and GB300 systems on display, along with their rack-scaled liquid-cooled solutions.
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