The demand for high-speed data transmission and the rapid expansion of data centers and cloud services have led to significant growth in the co-packaged optics (CPO) market. With the increasing need for network speeds driven by artificial intelligence, the adoption of CPO technology is expected to accelerate in the coming years. According to LightCounting, shipments of CPO technology are projected to begin with 800G and 1.6T ports, with commercialization starting between 2024 and 2025, and widespread deployment expected between 2026 and 2027. This technology will primarily be used in short-distance data communication scenarios for hyperscale cloud service providers.
Co-Packaged Optics (CPO) is a revolutionary photoelectric co-packaging technology that combines the optical engine and switching chip into a single package. This integration results in higher levels of integration, cost reduction, and lower power consumption. By bringing the optical engine closer to the switching chip, CPO technology minimizes the distance that optical signals need to travel, leading to lower power consumption by the SerDes.
NVIDIA’s development roadmap includes plans to launch a CPO version of the Quantum 3400 X800 InfiniBand switch in Q3 2025, followed by the Spectrum4 Ultra X800 Ethernet switch in 2026. These switches will feature high-density optical interfaces and switching chips, providing significant switching capacity for data centers and cloud services.
The architecture of these switches utilizes a multi-plane design to efficiently distribute optical signals. A shuffle box is used to split fibers into separate paths, connecting them to different switch chips for optimized throughput and reduced signal congestion. This innovative approach enhances signal routing and processing within the switch.
To manage the routing of thousands of internal fiber connections, advanced solutions such as fiber flexible circuit products are employed. These products enable higher-density optical routing solutions, significantly increasing fiber capacity within data center cabinets while maintaining signal integrity and performance.
High-density connectors like MPO and MMC connectors are crucial for enabling high-speed, high-density signal connections in CPO switches. By utilizing these connectors, the number of ports needed on the front panel can be reduced, streamlining deployment and improving integration efficiency.
External Laser Sources (ELS) are widely adopted for CPO light sources due to their ease of maintenance and cost-effectiveness. Polarization Maintaining Fiber (PMF) is used to connect the light source to the switching chip, ensuring stable signal transmission by maintaining the polarization state of the incident light.
Optical interconnection between silicon-based optoelectronic chips and external optical fibers requires precise alignment and low-loss signal transmission. 3D optical waveguides offer a reliable solution for efficient interconnection by enabling flexible light guidance and coupling in three-dimensional space.
HYC, a leader in passive optical device manufacturing, provides customized optical interconnect solutions for future CPO connectivity. Their offerings include fiber flex circuits, MPO/MTP assemblies, PM assemblies, and optics design platforms to support the high-performance requirements of CPO modules and facilitate high-speed interconnect development.
For more information, visit HYC’s website at www.hyc-system.com.